9 reasons to use Megasonic
For better cleaning results without damage
Today there is a number of challenges when it comes to the cleaning of micro- and nano-structures. Key focus is the removal of smallest particle residues from wafer or photomask surfaces to increase the yield (=good wafers out of total production). Thereby, the cleaning must be effective, but smooth, in order to not damage the fine structures.
On top of these technical challenges there are the concerns about product and supplier reliability, which is key to this highly automated processing industries. A reliable and flexible partner is therefore mandatory.
Against the background of the above mentioned, which benefits can the SONOSYS® solutions provide? - Have a look at the following listing for our main benefits:
Need more details on the benefits? - Please get in touch with keyword "Benefits" to get more information.